Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate

摘要

The printed circuit mfg. process uses a standard high-speed printer using an ink jet printing head which is movable along at least two orthogonal coordinates and pref. along all three orthogonal coordinates. The printing head is used to apply metallised conductor paths, a lacquer coating, etching fluid, flux or solder directly onto the surface of the circuit board where required. The printing head may be of fine steel and it can be heated, or alternatively, the circuit board itself can be heated. Several different printing heads can be used, each providing a different function. The process allows a rapid mfg. rate for the circuit boards.