HALBLEITERANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG

摘要

A mounting and cooling arrangement for a semiconductor pellet (6) comprises an external lead (19) having a paddle-like segment (5) to which a main surface of the semiconductor pellet is adhered with electrical contact; further external leads (20,21) which are electrically connected (22) to another main surface of the semiconductor pellet; a heat-radiating member (2) made of a metal; an insulator (28) interposed between the paddle-like segment (5) and the heat-radiating member (2) to electrically insulate them from each other; and a sealing member (10) for sealing the semiconductor pellet, the paddle- like segment and the insulating member. This arrangement obviates the need for a separate insulating mica plate when the member (2) is bolted to a heat sink. Various other ways of achieving insulation between the semiconductor pellet and the heat-radiating member are also disclosed.