Semiconductor device with cold welded package and method of sealing the same,申请号US19610156768-传众专利搜索

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发明名称	Semiconductor device with cold welded package and method of sealing the same
摘要
申请公布号	US3219748(A)	申请公布日期	1965.11.23
申请号	US19610156768	申请日期	1961.12.04
申请人	MOTOROLA, INC.	发明人	MILLER CHARLES FREDRICK
分类号	H01L23/045;H01L23/488	主分类号	H01L23/045
代理机构		代理人
主权项
地址

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