| 摘要 |
PURPOSE:To perform reliable picking up without break in a chip by a method wherein when the semiconductor chip which is placed and attached on a tape with a proper spacing is picked up, on a pair of arms of a pincette which bring the chip between, a driving device to close them is provided. CONSTITUTION:Dicing is performed after a semiconductor wafer is attached on an extendable tape 13, and by extending the tape 13, semiconductor chips 14 which is formed by dicing are separated to have a specified distance individually, and they are fixed on an extending ring 11. Next to pick up each chip 14 by bringing them between a main part 22 of a pincette which constitutes a pick-up mechanism 18, narrowed parts are provided in the midway on a pair of arms in the main part 22 of the pincette, and spring action is given, a driving mechanism 23 is installed below them, and arm is opened and closed by means of pneumatic cylinder. And the main part 18 of the pincette is supported by arm 21 at its upper side. |
