| 摘要 |
PURPOSE:To prevent the escape of a wire, and to improve bonding property by mounting a wire guide at the tip of a wedge of an ultrasonic wire bonder and retreating the wire guide from the tip of a connector at a point approaching to the next bonding point. CONSTITUTION:When the connector of the ultrasonic wire bonder connects the wire to one bonding point, and is moved to the next bonding point and the wire draws a loop, the wire guide 5 guiding the wire is positioned at the side of the wire at the tip 1b of the wedge 1, and the wire guide 5 is retreated from the tip of the connector at a point approaching to the next bonding point. Accordingly, the escape of the wire is prevented, and the bonding property can be improved. |
