发明名称 SOLDERING DEVICE
摘要 PURPOSE:To prevent the generation of soldering defects of chip parts and improve quality by specifying the distance between two pieces of solder ejection ports. CONSTITUTION:The distance l between the front edge 9' of the 1st nozzle and the rear edge 11' of the 2nd nozzle is set at >=3cm and <=20cm. A printed substrate 4 comes into contact with the solder waves 10 flowed by the 1st nozzle 9 only in the same direction as the advance direction thereof. Thence, it comes into contact with the dolder waves 12 flowed from the 2nd nozzle 11 in the direction opposite from the advancing direction of the substrate. In this case, the front parts 6 of chip parts 3 with respect to the advancing direction of the substrate 4 are acted with the solder waves 12 and the rear parts 8 with the solder waves 10 by the nozzle 9, and the solder waves 12 caused by the nozzle 11 and the substrate 4 incline with respect to the advancing direction.
申请公布号 JPS57109568(A) 申请公布日期 1982.07.08
申请号 JP19800186365 申请日期 1980.12.26
申请人 MATSUSHITA DENKI SANGYO KK 发明人 MATSUDA CHIYUUICHI;SAEKI KEIJI;INOUE TAKAO
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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