发明名称 INJECTION MOLDING METHOD
摘要 PURPOSE:To enable to mass-produce the molded object having the protruded pattern on the front panel, by injection molding the object to be molded as the required pattern on the substrate via the thermoplastic film. CONSTITUTION:The thermoplastic film which adheres the molded object to the substrate 2 by heat and pressure bonding, e.g. the film composed of polyolefine type, EVA type resin etc. as the base, is put on the substrate 2 of the object to be molded and resin is injection molded on it as the required pattern. The molded object of the pattern S is molded and fixed to the substrate 2 by heat bonding during the molding time. By this, resin molded object having the protruding pattern on the front panel of the planar push switch is obtained.
申请公布号 JPS57109633(A) 申请公布日期 1982.07.08
申请号 JP19800186668 申请日期 1980.12.27
申请人 SONY KK 发明人 TAKEUCHI TETSUO
分类号 H01H11/00;B29C35/00;B29C45/14;B29C45/16;H01H13/00;H01H13/702;H05K5/00 主分类号 H01H11/00
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