| 摘要 |
The invention relates to a network for supplying electrical power to the electronic components (13a,13b,13c...) formed in one surface (12) of the substrate (11) of an integrated circuit device (10). According to the invention, the feed conductors (14a,14b,14c,...) of the metallic interconnection network (14) for the components are connected to the supply terminals (15a...) via distribution conductors (19) formed above the network (14) and are thus able to have an optional thickness and width, appropriate to have a very low electrical resistance. In this manner, the supply conductors (14a...) may be limited to a small width, thus making it possible to increase the density of the signal conductors and of the distribution of the components in the substrate. The invention is applicable in particular to large-scale integrated circuits. <IMAGE> |
