| 摘要 |
PURPOSE:To improve lead material properties with respect to radiation of heat, resistance to high temperature, strength, solder application, and plating adhesion by a method wherein Ni and P are added to the oxygen free Cu base whose quantities are so small that they cause little deterioration of alloy properties as to workability and thermal conductivity. CONSTITUTION:Oxygen free Cu containing inevitable impurities including less than 0.0010wt% of oxygen is used as the alloy base. A 0.01-1.0wt% of Ni and a 0.001-0.1wt% of P are added to the base. A Cu alloy containing such very small quantities of additives is quite excellent in heat radiation, resistance to high temperature, strength, application of solder, and adhesion of plating. |
