| 摘要 |
PURPOSE:To perform a highly accurate positional matching between the wafer and the mask substrate by a method wherein the image of matching reference to be used for wafers is image formed on the matching reference for masks on the surface of the mask substrate through the intermediary of a Fresnel zone pattern, and the mutual positional information of the mask substrate and the wafer is obtained. CONSTITUTION:The matching reference 2 for wafers is provided on the wafer 1, and at the same time, the matching reference 4 for masks is provided on the surface of the mask substrate 3. Then, the Fresnel zone pattern 5 is formed at the section corresponding to the matching reference 4 for masks located on the reverse side of the mask substrate 3. The image of the matching reference 2 for wafers is image formed on the matching reference 4 for masks located on the surface of the mask substrate 3 through the intermediary of the Fresnel zone pattern 5, matching references 2 and 4 for wafers and masks are superpositioned in the same plane surface, and the mutual positional information on the mask reference 3 and the wafer 1 can be obtained. |
