发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To perform uniform wire bonding by a method wherein an oscillating output value or the like is memorized on wire-bonding, and based on the memorized data a wire bonder is controlled. CONSTITUTION:A mechanizm 1 of a bonder is so constructed that a horn 4 is installed to be integral with a holder arm 3 and it is vertically movable taking an axis 5 as a pivot, and integral with them a tool 7 through which a wire 6 is passed is set to be able to move vertically. A control part 2 memorizes value of an oscillating output, an oscillating duration and a pressing duration or the like into an interior thereof, and has a computer 24 capable of an output control. Accordingly, because the bonder mechanizm 1 is controlled based on the memorized data, excellent bonding is performed with a pressed shape being maintined unchanged.
申请公布号 JPS57109348(A) 申请公布日期 1982.07.07
申请号 JP19800183900 申请日期 1980.12.26
申请人 HITACHI SEISAKUSHO KK 发明人 UEMATSU SHIYUNEI
分类号 B23K20/00;H01L21/60;H01L21/607 主分类号 B23K20/00
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