| 摘要 |
PURPOSE:To improve mounting and bonding performance by a method wherein in addition to mounting of a semiconductor element on a substrate for element arrangement consisting of single element of copper or copper alloy, an electrode on the element and the substrate are connected by a wire. CONSTITUTION:After a bipolar silicon transistor 104 which is formed by sequential lamination of a vanadium layer 105, a nickel layer 106, a gold and germanium layer and a gold layer being laminated on an island region 102 of a lead frame consisting of single element of copper or copper alloy, it is mounted by heating and pressing. Through its mounting, a junction layer 109 consisting of full solid solution of Au-Ge-Cu is formed. An electrode 110a of a base or the like on the element 104 is connected to a lead region 103a by means of post-bonding with a gold wire 111. Accordingly, because a preformed gold object is not used, fault occurrence in a wire bonding process can be reduced while enabling a precise positioning when mounting is performed. |
