| 摘要 |
PURPOSE:To improve mounting performance by a method wherein on a substrate for element arrangement consisting of copper or copper alloy, a semiconductor element which is formed by lamination of a barrier metal layer and an alloy layer which has gold or the like as a pricipal component is mounted. CONSTITUTION:After a bipolar silicon semiconductor element 104 which is formed by lamination of a vanadium layer 105, a nickel layer 106, a gold and germanium alloy layer and a gold layer, is laminated on an island region 102 of a lead frame consisting of single element of copper or copper alloy, it is mounted by heating and pressing, and a junction layer 109 consisting of full solid solution of Au-Ge-Cu is formed. Accordingly, because of a junction with intermediaries of a barrier metal layer consisting of layers 105, 106 and a junction layer 109 which does not contain silicon, firm mounting can be attained. |
