发明名称 LEAD FRAMES
摘要 <p>9201 A lead frame is capable of use with integrated circuit chips of different sizes and having different numbers of terminal areas, in that it comprises a centrally located support member, and a plurality of leads having inner end portions which are integral with the support member and having outer portions forming a radiating pattern relative to the support member, at least one of the leads being a composite lead comprising a trunk lead and branch leads extending from side edges of the trunk lead at spaced intervals and at increasing distances from the support member, whereby the lead frame can be used with a relatively small chip by removing the support member and connecting the leads, excluding the trunk lead, to the terminal areas of the chip, and the lead frame can be used with larger sizes of chips by removing the support member and a portion of the trunk lead adjacent to the support member whereby branch and other leads can be connected to terminal areas of the chip.</p>
申请公布号 CA1127319(A) 申请公布日期 1982.07.06
申请号 CA19800344452 申请日期 1980.01.28
申请人 AMP INCORPORATED 发明人 GRABBE, DIMITRY G.;PATTERSON, RONALD
分类号 H01L23/50;H01L23/047;H01L23/495;(IPC1-7):05K1/18 主分类号 H01L23/50
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