发明名称 |
APPARATUS FOR MOUNTING ELECTRONIC COMPONENTS |
摘要 |
<p>An apparatus for mounting electronic components on a printed board substrate comprises a component feeder for sequentially feeding the electronic components in an aligned row, a chuck which receives and rectifies by pinching the position of the electronic components, a vertically movable mounting head, which holds by air suction one of the electronic components preliminarily pinched and rectified of the position by the chuck, and goes down through a wide open gap of the chuck to mount the electronic component on an accurate position of the substrate.</p> |
申请公布号 |
CA1126936(A) |
申请公布日期 |
1982.07.06 |
申请号 |
CA19800346888 |
申请日期 |
1980.03.04 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MAKIZAWA, YOSHIAKI;YAMAMOTO, KATSUYUKI;HATA, KANJI |
分类号 |
B23P21/00;H01L21/677;H05K13/00;H05K13/04;(IPC1-7):01L21/58;01L21/96 |
主分类号 |
B23P21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|