| 摘要 |
PURPOSE:To improve the productivity of bonding of the pressure sensor by a method wherein the die bonding hole of the holder of the pressure sensor having a die to which the holder and a silicon gage are joined is made to have a tapered form. CONSTITUTION:After the silicon gage detecting pressure is joined to the die 6, the holder 2 introducing the pressure is inserted into the hole 25 of the die 6 and an adhesive 8 is applied thereto and set. On the occasion of this setting, the viscosity of the adhesive 8 lowers and the adhesive 8 is filled up into the hole 25 along a taper 30 provided in the hole 25 of the die 6. Next, a plastic case 1 at which lead frames 4 are formed by molding and the holder 2 are bonded and set, the silicon gage 7 and the lead frames 4 are bonded by fine wires 9, and the plastic case 1 and a cover 3 are bonded and set. And, wires 5 are welded to the lead frames 4 to take out pressure signals. Since the holder 2 has the tapered form in this way, bonding of the die 6 can be conducted easily and thus the productivity of bonding is enhanced. |
