| 摘要 |
PURPOSE:To permit a processing for a long size work by a method wherein a plurality of lead frames connected successively are mounted on a holder having a hard metallic material provided in the under face of a bonding portion, the both side ends of the lead frame are pressed by a spring and a substrate mounting portion is adhered to be fixed. CONSTITUTION:For example, a lead frame 25 for a single in line type package use, in which a plurality of units are connected by a connection material and an element 3 is adhered to each unit, is fixed to a work holder mounted on X-Y table 22 and a bonding is performed by replacing in turn a position. The holder 26 consisting of Al-made substrate 28 has a hard metallic step brass 29 fixed to the under face of the bonding portion. The lead frame 25 wherein a part of the lead terminal is molded with a resin 9, is fixed to the holder 26 through a vacuum adhesion from a concave 33 and a connecting portion 18 and an element mounting portion 2 are pressed by springs 30 and 31 respectively. In such a way a continuous wire bonding can be achieved by fixing surely the lead frame, and further a long life of the holder also be maintained. |
