| 摘要 |
PURPOSE:To prevent a readhesion of mist to a substrate by a method wherein a pressure reducing duct is provided in the manner such as to surround the substrate and an air inlet port is provided while making it face to the circumferential edge of the substrate on the inner circumferential face of the foregoing duct when coating solution is dripped on a semiconductor substrate held horizontally and a thin coating film is formed by revolving the substrate high speed. CONSTITUTION:A wafer 2 is attached onto a wafer rotary support 1, a nozzle 3 for jetting coating liquid is provided over the wafer 2, and the coating liquid is dripped from the nozzle 3 to cover the entire surface of the wafer 2. Subsequently, a thin coating film is formed on the wafer 2 by revolving the support 1 at high speed. According to such a constitution, a pressure reducing duct 14 is provided in the manner such as to surround the wafer 2, the mist separated from the circumferential edge of the wafer 2 is removed without readhering it to the wafer 2. Namely, the duct 14 consists of its inner wall 14a and external wall 14b, a slit-like absorption port 14c is provided at a portion opposing to the circumferential edge of the wafer 2. Then the mist is absorbed into a connection port 14d leading to a pressure reducing source and finally is discharged from a discharge port 14e. |
