发明名称 COOLING SYSTEM FOR COOLING ELECTRICAL COMPONENTS, IN PARTICULAR INTEGRATED COMPONENTS
摘要 1. A cooling arrangement for cooling electrical components, in particular integrated modules, which are formed on flat assemblies (preferably plug-in assemblies) the flat sides of which are arranged one beside another said arrangement comprising a liquid coolant which is passed through thin-walled synthetic containers which are arranged with one of their side walls in contact with the surface of the flat assembly whichis to be cooled and wherein a closed circuit is formed outside the unit serving to accomodate the flat assembly, by way of common collector pipes, a pump, a cooler for recooling the coolant, and a storage container, characterized in that each flat assembly (1) is directly structurally combined with at least one synthetic resin container (2) ; that the synthetic resin container (2) consists of upper and lower parts consisting of thin, flexible elastic and tear-resistant synthetic resin flims which are, for example, welded to one another ; that the inflow of liquid (4) takes place at one end of the lond side of said synthetic resin container (2) and the liquid outflow at the other end thereof ; and that on that side of the synthetic resin container (2) which is remote from the flat assembly (1) there is arranged a cover plate (3) which is attached to the flat assembly (1) by means of fastening elements(6).
申请公布号 EP0014249(B1) 申请公布日期 1982.06.30
申请号 EP19790105071 申请日期 1979.12.10
申请人 SIEMENS AKTIENGESELLSCHAFT BERLIN UND MUNCHEN 发明人 RICHTER, HANS-JURGEN, DIPL.-ING.;GRAF, HANS;DINKLAGE, JORG-ULRICH
分类号 F28F3/12;H01L23/473;H05K7/20;(IPC1-7):01L23/46;05K7/20 主分类号 F28F3/12
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