发明名称 |
COOLING SYSTEM FOR COOLING ELECTRICAL COMPONENTS, IN PARTICULAR INTEGRATED COMPONENTS |
摘要 |
1. A cooling arrangement for cooling electrical components, in particular integrated modules, which are formed on flat assemblies (preferably plug-in assemblies) the flat sides of which are arranged one beside another said arrangement comprising a liquid coolant which is passed through thin-walled synthetic containers which are arranged with one of their side walls in contact with the surface of the flat assembly whichis to be cooled and wherein a closed circuit is formed outside the unit serving to accomodate the flat assembly, by way of common collector pipes, a pump, a cooler for recooling the coolant, and a storage container, characterized in that each flat assembly (1) is directly structurally combined with at least one synthetic resin container (2) ; that the synthetic resin container (2) consists of upper and lower parts consisting of thin, flexible elastic and tear-resistant synthetic resin flims which are, for example, welded to one another ; that the inflow of liquid (4) takes place at one end of the lond side of said synthetic resin container (2) and the liquid outflow at the other end thereof ; and that on that side of the synthetic resin container (2) which is remote from the flat assembly (1) there is arranged a cover plate (3) which is attached to the flat assembly (1) by means of fastening elements(6). |
申请公布号 |
EP0014249(B1) |
申请公布日期 |
1982.06.30 |
申请号 |
EP19790105071 |
申请日期 |
1979.12.10 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT BERLIN UND MUNCHEN |
发明人 |
RICHTER, HANS-JURGEN, DIPL.-ING.;GRAF, HANS;DINKLAGE, JORG-ULRICH |
分类号 |
F28F3/12;H01L23/473;H05K7/20;(IPC1-7):01L23/46;05K7/20 |
主分类号 |
F28F3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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