| 摘要 |
A process for conformally coating an irregularly shaped article, e.g. an electronic circuit board with components attached, comprises coating the article, e.g., by dipping or spraying with a composition comprising (1) a solventless, radiation and heat curable, reactive, liquid resin containing at least two olefinic carbon- to-carbon double bonds per molecule; (2) a thermal initiator for (1); and optionally; (3) a photoinitiator for (1); and exposing said coated article to radiation and heating the article to a temperature in the range 50 to 250 DEG C for a time sufficient to obtain a completely cured solid coating. The radiation exposure is preferably effected before the heating. If high energy ionizing radiation is used, no photoinitiator is necessary in the composition. Preferred compositions are UV-curable and contain a photoinitiator. r |
