Package for Electronic Components

摘要

A DIL pack is constructed in part from glass fibre reinforced resin. As shown the pack has a ceramic base 10 on which are mounted circuit components 12 and a lead frame 14, the ceramic base 10 having printed thereon conductors connected to the circuit components and the lead frame 14. A glass fibre reinforced resin ring frame 20 is adhered to the base 14 and has adhered to it a lid 24.