| 发明名称 |
Cooling device for module pins. |
| 摘要 |
<p>Device for cooling the modules of integrated circuits, comprising sleeves (4) which are placed around the pins (3) of the module to be cooled (1). Each sleeve comprises a hollow cylindrical body which receives a pin and heat-diffusing fins. At the same time these sleeves serve as spacers between the module and the board into which it is plugged. <IMAGE></p> |
| 申请公布号 |
EP0054597(A1) |
申请公布日期 |
1982.06.30 |
| 申请号 |
EP19800430031 |
申请日期 |
1980.12.18 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;COMPAGNIE IBM FRANCE |
发明人 |
FALDA, ANDRE;KLEIN, DANIEL JACQUES HENRI |
| 分类号 |
H05K7/20;H01L23/34;H01L23/367;H01L23/40;H01L23/49;H01R13/533;(IPC1-7):01L23/48;01L23/40;01L23/36;01R13/533 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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