| 摘要 |
PURPOSE:To prevent a warp generated in a substrate in a heating process by a method wherein a large number of the substrates and spacers are fast stuck and pressed and housed in a pressure jig while putting the spacers on one main surfaces of the substrates, the substrates and the spacers are heated together with the pressure jig, and resistance paints are baked. CONSTITUTION:A hybrid integrated circuit substrate is formed by a metal such as aluminum, and an insulating film is shaped through the anode oxidation, etc. of the surface and the surface is coated with the film. Copper foil is pasted onto the surfaces of the substrates and predetermined circuit patterns are formed through etching, and the resistance paints are screen-printed at prescribed positions and baked and resistors are shaped. When baking, however, the spacers 5, which contact with the fringes of the substrates 1 (dotted lines) and have vent slits 6, are contacted with the surfaces of the substrates, and the resistance paints are baked and the substrates are annealed under a condition that the spacers 5 and the substrates 1 are held alternately and pressed. Accordingly, a warp and torsion can be prevented even when the thickness of the substrate 1 is 1mm. or thinner. |
