| 摘要 |
<p>Disclosed is an integrated circuit package that is comprised of a substrate (12), a first integrated circuit chip (11a), and a thermoplastic material (20a) which rigidly attaches the first chip to the substrate. This thermoplastic material is an organic polymer capable of repeatedly being softened when heated and hardened again when cooled, such as polyethylene. The thermoplastic material is disposed on the substrate in a manner that enables the first chip to be removed and to be replaced with a second chip by a softening-hardening sequence.</p> |
