| 摘要 |
<p>A plating method which comprise disposing a linear workpiece in a plating bath with the region to be plated immersed in the bath. A pair of flat thin input streams of electrolyte is then caused to be directed against both sides of the immersed portion simultaneously at substantially the same rate and the electrolyte is withdrawn downwardly from below the workpiece at a rate not in excess of the input rate. Finally, an electric current is passed through the workpiece as cathode and through the solution to a pair of anodes disposed below the workpiece and on either side of it. An apparatus for carrying out this method is also disclosed. With this method and apparatus there is no need to mask the portion which is to be left unplated.</p> |
