| 摘要 |
<p>PURPOSE:To perform specified position setting and prevent cracking and breaking by a method wherein on the inner side wall of a die bonding region of an outer container which fixes an IC chip of a large size, projected parts are provided. CONSTITUTION:Four projected parts 9 are provided which are projected inward individually from four side walls of a die bonding part 2a in an outer container 2. This side wall projected part 9 of the die bonding part is installed to be integrated with the outer container to maintain a fixed positional relationship between an IC chip 1 and the outer container 2. In this configuration spacings at those tips are equal to sizes of the IC chip. By this arrangement, cracking and breaking in an IC chip of a large size such as a solid state image sensing element is prevented, and it is placed precisely at a fixed position of the outer container.</p> |
