| 摘要 |
A semiconductor wafer (1) is provided with two electrodes (3, 4) of conductive material which are substantially cylindrical in shape and on the same axis as the semiconductor wafer (1). Grooves (5) are formed on the external faces of these electrodes, i.e. that face remote from the semiconductor wafer, so as to present a large surface area promoting heat exchange with the medium in which the assembly is arranged. In a preferred form the grooves (5) are parallel with one another. Such an electrode structure is used in the manufacture of diodes or thyristors designed for electric traction applications. <IMAGE> |
