| 摘要 |
PURPOSE:To prevent an IC chip from breaking or cracking and fix the IC chip to a certain position of a package by a method wherein a positioning means which determines positions of corners of the IC chip is provided where the IC chip is fixed. CONSTITUTION:When a package 22 is made, an L-shape convex part and a side wall 29 of a die-bonding part are formed into one body in order to make a relative position of the package 22 and an IC chip 21 which is to be fixed in a following process definite. The L-shape convex parts are provided to the all corners of the IC chip or to two places on the diagonal of the IC chip in order to prevent the IC chip from displacement or rotation. Then soldering material for fixing is put on the die-bonding part and the IC chip 21 to the back of which metal is provided is piled on the soldering material and the whole composition is transferred into a belt furnace in which an inert atmosphere of nitrogen is provided. With above method, alloy layers 24 are obtained between the soldering material for fixing and the gold layer of the IC chip 21 or gold plating 23 of the die-bonding part 22-1, so that the IC chip can be fixed. |
