| 摘要 |
PURPOSE:To facilitate automation of inspection of semicondutor devices by a method wherein plural number of the semiconductor devices are connected with an insulating material, and inspection of characteristic of individual semiconductor device is performed in the connected condition. CONSTITUTION:The plastic molded type semicondutor device 1-1-1-5 are connected with the insulating materials 2-1-2-4. When inspection of characteristic thereof is to be performed, the devices are arranged in a feeding mechanism in the connected condition to perform inspection. After inspection is finished, the devices are separated into the respective semicondutor devices. |
