发明名称 DEVICE FOR MOUNTING CIRCUIT PACKAGE IN SOCKET
摘要 Disclosed is apparatus for aligning a plurality of circuit packages in a row and transferring the row of circuit packages to a corresponding row of receiving sockets in a burn-in board. The apparatus includes a transfer arm carrying a transfer rack pivotal about a non-rotatable shaft which moves axially to raise and lower the transfer arm. The transfer rack includes a plurality of reciprocal blades adapted to receive the circuit packages therebetween and transfer them to the receiving sockets. The reciprocal blades are retracted to release the circuit packages and the pins on the circuit packages are inserted into the sockets by spring loaded plungers positioned intermediate the blades.
申请公布号 JPS5799761(A) 申请公布日期 1982.06.21
申请号 JP19810167007 申请日期 1981.10.19
申请人 UEIN KEE PURATSUFU 发明人 UEIN KEE PURATSUFU
分类号 H01L23/32;H05K13/02;H05K13/04 主分类号 H01L23/32
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