| 摘要 |
PURPOSE:To obtain a simple lead wire connecting constitution having excellent heat resistance by forming a temperature sensitive resistor film and electrode films on one surface of an insulating substrate, and connecting said electrode films and lead wires by low melting point metal. CONSTITUTION:The temperature sensitive resistor film 2 and the electrode films 3 are formed on one surface of the insulating substrate 1, and said electrode films 3 and the lead wires 4 are connected by the low melting point metal 6. Since the maximum temperature of 300-350 deg.C has to be detected in ovens and the like, it is desirable to have the melting point of 350-750 deg.C for the low melting point metal 6. As for the low melting point metal, the two element alloy which is selected among Au-Si, Au-In, Au-Ge, Au-Sn, Au-Sb, and Au-Zn has good affinity with the electrode films 3. Said alloy is stable in the oxide atomosphere such as air and excellent. Especially in the case the electrode film 3 is thick electrode film of Au or Au-Pt, since Au is included in the electrode film 3 as one component, the Au alloy has good adhesion with the electrode film 3. |
