| 摘要 |
PURPOSE:To connect a lead wire, by selecting a solid angle against a substrate face of an electric conductor forming hole arranged on the substrate which forms a thin film element, to the angle connecting a lead wire pull out terminal with a lead wire connecting terminal, and forming the conductor in this conductor forming hole. CONSTITUTION:Conductor forming hole 13 is formed by a machine work or chemical etching or ion etching on a part which is connected to a pull out conductor film of thin film element in a machine work which take place in later stage and located on a base 11. Conductive metallic bar 12 is inserted into an opening and adhered a resin or glass. Alternately, the hole 13 is packed with a conductive material 12 by a method such as plating or deposition. The base thus formed is cut and subject to machine work to obtain a floating slider. In this arrangement, the hole 13 is formed on a surface (x, y) on which a thin film element is formed through a side surface (y, x) and a conductive film 3 for lead wire of the thin film element 2 is connected to an external pull out lead wire 5 at side surface of the floating slider through connecting terminal 12 to perform a simple and stable connection. |
