发明名称 RUNNERLESS INJECTION MOLDING EQUIPMENT
摘要 PURPOSE:To enable the title equipment to reduce a cost and injection pressure remarkably by simplifying constitution, by enabling a gate part to be heated locally more than the outside by providing a heating mechanism such as a heater and, moreover, to perform thermal control extremely simply. CONSTITUTION:After molten raw material resin has attained to a preset temperature of a gate heating device 11, the molten raw material resin is injected by an injection molding device 2. When the inside of a sprue 3 bored within a mold 4 is filled with the molten resin, the inside of a cavity 7 is filled with the resin of predetermined capacity by passing a necessary quantity through a gate 16a of a gate part 12 from a runner part 10 of the sprue 3 by an action of the injection molding device 2. In this instance a molten state of the raw material resin in the inside of the gate part can be controlled in a highly sensitive state by feeding energy to the gate heating device 11 always or every time of molding operation by a heater H as a heating mechanism. In the next place, after the filled up resin in the inside of the cavity 7 has been solidified after the lapse of a fixed period of time, a movable mold 27 is broken and a molded product is taken out.
申请公布号 JPS63176121(A) 申请公布日期 1988.07.20
申请号 JP19870006246 申请日期 1987.01.16
申请人 SANRI KK 发明人 TSUTSUMI SEI
分类号 B29C45/26;B29C45/27;B29C45/73 主分类号 B29C45/26
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