| 摘要 |
<p>The invention relates to a mounting (10) for integrated circuit devices (11), which is intended to receive a cooling device (12), such as a radiator, on one face (136) of the substrate (13) of the mounting. According to the invention, a sheet (16) is inserted between the radiator (12) and the substrate (13), having a thermal expansion coefficient close to that of the material constituting the substrate (13), so that it is possible to removably attach the radiator to the sheet (16). The invention also applies to devices for cooling by circulating liquid. <IMAGE></p> |
