| 摘要 |
PURPOSE:To polish an edge of a semiconductor wafer uniformly and with accuracy by combining the rotary motion of a lapping dish and the reciprocating motion of the semiconductor wafer. CONSTITUTION:A palling dish 2 is rotated by a motor, and the semiconductor wafter 1 held by a holder 3 which moves up and down by means of a cylinder is pressed against the lapping dish 2. By this lapping dish 2 and lapping powder supplied from a nozzle 6, the semiconductor wafer 1 is polished. At the same time, a reciprocating motion is provided to the holder 3 by a sliding mechanism 5 through an arm 4, bringing the semiconductor wafer 1 in uniform contact with the lapping dish 2. As a result, uniform polishing of the periphery of the semiconductor wafer and uniform wear of the lapping dish are attained. |
