| 摘要 |
PURPOSE:To improve moisture resistance by providing a PSG film in the vicinity of a bonding pad provided on a field insulating film so as not to allow them to contact each other and by providing an insulating protective film between said PSG film and field insulating film and by providing said film in the manner that said protective film covers the periphery of said pad. CONSTITUTION:An Al bonding pad 4 is provided on a semiconductor substrate 1 having a high concentration impurity region 11 via a field insulating film 2, and a PSG film 3 is provided near said pad. And, an insulating protective film 5 is provided between said pad 4 and film 3, and is made such that said film 5 creeps around said pad 4. Consequently, even if cracks due to a mechanical impact caused by a bonding tool and the like are produced, reduction in moisture resistance can be prevented. |
