| 摘要 |
PURPOSE:To reduce the cost of a die bonding material of a pellet by changing a gold group ball thermocompression-bonded onto a header or a frame into foil by a chip giving ultrasonic vibration and preforming the foil. CONSTITUTION:The ball 2 formed by heating and shaping a tip of a bonding wire of an Au-Si group by a hydrogen torch, etc. is thermocompression-bonded onto an element fastening section of the header 1. The size of the ball 2 is set in response to the size of the pellet. The chip 3, a nose section thereof is made spherical, is given ultrasonic vibration, and the ball 2 is thinly stretched and changed into foil. Accordingly, since the ball can be turned into foil by slight ultrasonic energy, it can be converted into thin foil without sinking, and the preforming, which changes the pellet into a eutectic and fastens it, can be prepared at low cost. |
