| 摘要 |
PURPOSE:To obtain the device having long life in spacial surroundings by forming one part of a package by lead and obstructing the reaching of radiation from the outside to a chip. CONSTITUTION:The package having structure of which the outside of a ceramic material 2 is thickly coated with lead 1 is used for the device, which is loaded on an artificial satellite and employed in the surroundings of radiation of space. An encasing position of the semiconductor chip 4 is mounted into a concave section of the lower side package, and external leads 5 are attached through wires 7 and connecting wiring 6, but the ceramic materials 2 of wiring inserting sections are thinned as much as possible, and clearance sections not covered with the lead 1 are narrowed. The package is assembled in such a manner that the ceramic material 2 section is fabricated and the molds of lead are mounted up and down. Accordingly, the device can be given radiation resisting property, and the device having long life in the spacial surroundings can be manufactured. |
