| 摘要 |
PURPOSE:To reduce the thermal resistance of a resin sealing device by arranging an internal lead section of a base ribbon and an island section on which an element is fastened onto different planes and making the size of the island section approximately the same as the external size of a package. CONSTITUTION:The element such as an IC chip 2 is mounted onto the island 1 of the base ribbn with size approximately the same as the plastic package 5. The swicth sides 4 of external leads, which are not positioned on the same plane as the island 1, and wire-bonded by gold wires 3, and sealed and molded with plastic. Accordingly, since the size of the island 1 is enlarged, a radiating effect of the resin sealing device is improved, and the thermal resistance can be reduced. When low thermal resistance type plastic is used and the base ribbon is thickly plated with Ag, etc., the thermal resistance can further be decreased. |
