| 摘要 |
PURPOSE:To check characteristics without forming an exclusive terminal by connecting a monitor element between terminals, which are shaped to an IC chip, substantially insulated previously before wiring and brought to the same potential after wiring. CONSTITUTION:In the IC chip 10 to which an operational amplifier 12 is prepared, grounding terminals (or pads) 28, 34 are formed. A section between the terminals 28, 34 is under an insulating condition at a wafer stage, and is brought to the same grounding potential after the chip 10 is mounted and wired to a stage 20. The monitor element 30, such as a pinch resistor 30a, a MOSFET 30b, etc. is prepared previously between the terminals 28, 34 according to the same process as an IC, and connected. Accordingly, characteristics such as the value of the hFE of a bipolar transistor and the Vth of a MOSFET can be checked without shaping the exclusive terminal. |
