| 摘要 |
PURPOSE:To accurately form a micropattern in a high yield by coating a substrate with a photosensitive film, imagewise exposing the substrate, and exposing it to plasma contg. oxygen. CONSTITUTION:A film 2 such as a silicon oxide film is formed on a substrate 1, and it is coated with a photoresist 3. The substrate is selectively irradiated with ultraviolet light through a photomask. Thus, the photoresist is separated into an exposed part 3b and an unexposed part 3a. By carrying out said processes in an atmosphere contg. nitrogen, a thin reaction product layer 3c soluble slightly in a developer and having several 100-several 1,000Angstrom thickness is formed on the surface of the photoresist layer. The whole substrate is then exposed to oxygen plasma with 200W RF power for 10min to remove the layer 3c, and development is carried out. |
