| 摘要 |
PURPOSE:To reduce the contacting resistance of a semiconductor device by increasing a lead formed on the outer periphery formed on an insulating film in width larger than the other pad connected to a power source or ground of the wide pads. CONSTITUTION:Pads 7 formed on a tape 1 formed of an insulating film 1 having sprocket holes 2 is formed wider than the lead 5, and the area of the pad connected to the lead for a power source or a ground is increased larger than that of the other pad. Thus, the contacting resistance when a probe is contacted with the pad can be reduced. |
