| 摘要 |
A method for electroless copper-plating comprising immersing a surface to be plated in a conventional bath of an alkaline aqueous solution of a cupric salt, a complexing agent for cupric (II) ions and reducing agents which additionally contain an oxide inclusion preventing agent of the formula R'R''N-R3-COOH wherein R' and R'' each is hydrogen or alkyl and R3 and aryl, the amino group and the carboxylic group being in para position with respect to each other. As a consequence of the addition of the agent for preventing oxide inclusions in the copper plating, the latter is provided with high ductility and this confers resistance to heat shock. Preferred embodiments of the agent for preventing oxide inclusions are p-aminobenzoic acid, p-methylaminobenzoic acid, p-dimethylaminobenzoic acid or p-aminosalicylic acid. |
