| 摘要 |
PURPOSE:To enable the application of a tape carrier system to a semiconductor element having many electrodes by increasing the number of pad rows arranged in a short axis direction of an insulating film more than that of the pad columns arranged in long axis direction. CONSTITUTION:When pads 7 are provided on a tape 1 formed of a flexible insulating film having sprockets 2, device holes 3 and supporting frames 8, the number of pad rows arranged in the short axis direction of the tape is increased than that of the pad columns arranged in long axis direction. Thus, the tape carrier system can be applied also for a semiconductor pellet having large size and many electrodes. |
