| 摘要 |
PURPOSE:To enable to connect a pellet to a lead frame fixing the posture of the pellet thereof by a method wherein plural number of grooves having breadth narrower than breadth of the pellet to be mounted are cut on the semiconductor element mounting part of the lead frame. CONSTITUTION:The plural number of grooves 18 having breadth narrower than breadth of the pellet 17 are cut lengthwise and crosswise on the surface of the lead frame 16. The grooves 18 are connected mutually, and even when quantity of solder to be used when the pellet 17 is to be connected to the lead frame 16 is abundant, solder flows in the gooves 18, and expands in the grooves 18 at the circumference of the pellet. Accordingly surplus solder at the lower part of the pellet 17 is removed to be flattened, and inclination of the pellet 17 can be restricted. |
