| 摘要 |
PURPOSE:To increase the adhesive strength of a sealing material, and to improve the reliability of airtight sealing by a method whrein the sealing material is attached to a sealing section of a package with a hollow section and heated and hermetically sealed in an atmospheric gas, and gas pressure is incrased under a temperature-rise condition. CONSTITUTION:In a sealing method for the type package using glass frit, the atmospheric gas is supplied to a sealing device 2 through a flow rate regulating valve 1, and the gas is discharged previously by means of a leakage valve 3. The sealing section of the package is coated with the glass frit and housed in the device 2, the inside of the device is brought to proper pressure and the temperature is elevated, and the glass frit is melted and the sealing section is bonded. The temperature of the sealing section is elevated, and the sealing section is heated and held while the inner pressure of the device is increased, the glass frit sufficiently spreads to the sealing section, the temperature is dropped, the frit is cured while the leakage valve 3 is opened, the inner pressure is reduced and the sealing section is cooled. Accordingly, since the pressure difference of the inside and the outside of the vessel at the time of sealing is relaxed, the sealing section can be sealed in unform thickness, and the semiconductor device can be strengthened against a thermal shock, etc. |
