发明名称 Casing for power semiconductors - has base plate forming heat sink with semiconductors encapsulated hardened plastics material
摘要 <p>The box is used for power semiconductors with fast connection type terminals and includes a metal base (1) on which the semiconductor components themselves (6,7) lie. Along the two sides of the base there are insulating bars (8,9) on which metal plates (11-14) lie. These are integral with the projecting terminals (15-18) which correspond to the chosen type of Faston terminal. The projecting terminals are folded up at right angles to the main surface of the base. They are then held in position by passing through windows cut in the plastics cover which fit down on to the plate. The cover is subsequently filled with a hardened plastics material. Soldered wires (19,23) link the semiconductors to the metal plates. The semiconductors lie on an electrically insulating, thermally conducting sheet (4) on top of a thermally conducting sheet of material which dissipates heat.</p>
申请公布号 FR2495376(A1) 申请公布日期 1982.06.04
申请号 FR19800025557 申请日期 1980.12.02
申请人 THOMSON CSF 发明人 ROGER LAUGIER
分类号 H01L23/047;H01L23/049;H01L23/31;H01L23/495;H01L25/07;(IPC1-7):01L23/02 主分类号 H01L23/047
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