Solder and watertight relay mounting - has foil placed on housing base plate and-or lid and sealed by adhesive and/or pressure and heat application

摘要

The relay is mounted in a pot-shaped retaining casing. The relay is supported on the casing bottom, or gripped by a cover plate. In both instanced the terminals of the switching and contact springs, or of the relay electromagnet p#ot#ude through apertures in the bottom or cover plate respectively. For sealing the relay mounting against solder and water penetration a foil is deposited on the casing bottom or cover plate. The foil is deformed by heat or adhesinve, or by solvents and/or pressure for sealing the joint gaps between the terminals and the aperture walls and/or the common separation surface between the casing and the cover plate. Pref., the foil is applied on the casing, or cover plate, inside, but it can be also deposited on the outside of these parts.