Base material for PCB mfr. - using a non-stick agent on the aluminium cover foil

摘要

The Parent Patent described a method for the production of a base material for printed circuit boards from a carrier material with a sensitisable surface film for an additive technique, in which a cover foil is fitted with the surface film, the film is joined to the carrier and the foil is removed before the sensitisations. Before the surface film is applied, it is now recommended to sinter a non-stick cover foil, accompanied by the action of heat. Alternatively a non-stock agent on the basis of silicone is crosslinked or hardened on the cover foil. This facilitates the use of Al foils for this purpose. PS.