| 摘要 |
1,126,079. Semi-conductor devices. SOC. ANON. DES USINES CHAUSSON. 7 April, 1966 [7 April, 1965], No. 15779/66. Heading H1K. A heat dissipator for an electric circuit component comprises a plate provided with a mounting region for the component and having a wire fixed to its surface at discrete locations spaced along the wire and across the plate, the wire extending away from the plate and back to it between each pair of adjacent fixing locations. As shown, Fig. I, a transistor 3 is mounted at the centre of a heat dissipator which comprises a plate 1 to both faces of which are attached helical coils 5 of wire. The coils are circular and are of circular section wire. The plate and the wires are of aluminum and are hard-soldered together by providing either the plate or the wires with a coating of aluminium-silicon alloy, pressing the parts together and heating to melt the alloy. In a modification the coil may have rectangular turns and be of square-section wire, Fig. 4 (not shown). The coils may be replaced by wires bent to form a plurality of spaced rectangular undulations joined by rectangular loops arranged perpendicularly to the undulations and bonded to the plate, Fig. 5 (not shown). In a further embodiment the wires are bent to form a plurality of undulations joined by straight portions which are force-fitted into grooves in the face of the plate followed by soldering or by covering the whole assembly with adhesive, Fig. 6 (not shown). The plate and wires may also be of copper or brass secured by soft-soldering. |
